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Mainly used in: 1.Thermal compression bonding, soldering, etc. of flexible circuit boards in electronic products such as LCD, PDP, and mobile phones. 2.Soldering of enameled wires such as HDD, coils, capacitors, motors, sensors, etc. 3.Soldering of cables and connectors in communications devices such as computers. 4.Soldering of CMOS, CCD and FBC boards for digital cameras, mobile phone, etc. 5.Resin hot press separation for relays, printers, compact cameras, etc.
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