The Development Trend of Precision Welding Head

In recent years, with the increasingly fierce competition in the consumer electronics market, the electronic product manufacturing industry has also put forward higher requirements for product. Traditional processing methods are easy to lead unstable product quality, melting of parts, difficulty in forming normal nuggets, and low yield. The emergence of laser processing technology can quickly solve these problems for electronic manufacturers. In the production process of high-end electronic products, laser processing plays an important role in the volume optimization and quality improvement of products, making the products lighter, thinner and more stable. It’s  reported that about 70% of the processing and manufacturing links of electronic products are applied to laser technology (more than 20 different processing) and related manufacturing equipment.

At present, laser precision soldering tip is mainly used in the shell of electronic product, shield, USB connector, conductive patch etc, the utility model has the advantages of small thermal deformation, accurate and controllable action, high soldering quality, welding of dissimilar materials ,easy automation and so on. But when soldering  different materials, different soldering methods need to be adopted.

According to the experimental results of many times, laser welding engineers concluded that in the production and manufacturing process of consumer electronics, high reflective materials, metal sheets, what kind of laser precision soldering tip should be used for different materials such as dissimilar materials to obtain better welding effect.

Laser precision soldering tip method of high reflective materials.

When welding high reflective materials such as aluminum and copper, different soldering waveform has a great impact on the soldering quality. The high reflectivity barrier can be broken through by using the laser waveform with front spike, Instantaneous high peak power can quickly change the state of metal surface and make its temperature rise to the melting point, thus reducing the reflectivity of metal surface and improving the utilization rate of energy. In addition, due to the fast heat conduction speed of copper, aluminum and other materials, the appearance of solder joints can be optimized by using the slowly decreasing waveform.

On the other hand, the absorption rate of gold, silver, copper and steel decreases with the increase of wavelength. For copper, when the laser wavelength is 532nm, the absorption rate of copper is close to 40%. By comparing analyzing the characteristics of infrared laser and green laser shows that infrared laser has large spot size, short focal depth and low absorption rate of red copper; The green laser has small spot size, long focal depth and high absorption rate of copper. Using infrared laser and green laser to impulsed soldering tip red copper respectively, it can be found that the soldering tip size of infrared laser after soldering is inconsistent; However, the green laser solder joint size is more uniform, the depth is consistent, and the surface is smooth. The soldering effect of using green laser is more stable, and the required peak power will be more than half lower than that of infrared laser.