- Shaped electrodes that concentrate current/heat flow - Electrodes that press against the metal pieces  - Controls/mechanisms to position electrodes accurately

In the manufacturing of multilayer ceramic capacitors (MLCCs), carrier tapes serve as critical substrates for supporting ceramic dielectrics and electrodes, where their precision and performance directly impact capacitor consistency and reliability. Traditional laser cutting or die-stamping processes are limited by machining accuracy (±20μm) and thermal stress, making them unsuitable for producing ultra-miniature 01005 (0.4×0.2mm) MLCCs. ‌Metal etching technology‌, with its unique advantages in precision microstructure fabrication, is bringing revolutionary opportunities to the MLCC carrier tape industry.

1. The tip of the spot welding head is separated, also called ordinary spot welding head, and the tip has an elastic contact surface to form ohmic contact; 2. The middle gap is between 0.05mm and 0.10mm; 3. It is easy to oxidize and has a lower high-temperature hardness than tungsten. It is suitable for ordinary spot welding heads such as flat and round shapes. It is easy to deform when making special-shaped spot welding heads;